Handbook of Semiconductor Interconnection Technology - Hardcover

Shwartz, Geraldine Cogin

Hardcover

ISBN 10: 1574446746 ISBN 13: 9781574446746

Publisher: CRC Press, 2006

Synopsis

First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.

What's in this Edition:

Detailed discussion of electrochemical equipment for plating copper

Information on tools used for evaporation, chemical vapor deposition, and plasma processes

Emphasis on measurement of mechanical and thermal properties of insulators

Methods for characterizing porous dielectric thin films

Greater focus on integration issues and properties of titanium, cobalt, and nickel silicides

Process schemes based on the increased need for borderless contact gates and source/drain

Expanded discussion on choices for low-dielectric insulators

Concentration on electroplated copper, especially morphology of plated films and their properties

Developments in thin film liners and barriers

Expanded material on copper reliability

About this title

About the Author

Geraldine C. Schwartz, Geraldine Cogin Shwartz, Kris V. Srikrishnan

Edition details

• Publisher: CRC Press
• Publication date: 2006
• Language: English
• ISBN 10: 1574446746
• ISBN 13: 9781574446746
• Binding: Hardcover
• Edition number: 2
• Number of pages: 536
• Editor: Schwartz Geraldine C., Srikrishnan Kris V.