Electronic Packaging Materials Science X: Volume 515 (MRS Proceedings) - Hardcover

Hardcover

ISBN 10: 1558994211 ISBN 13: 9781558994218

Publisher: Materials Research Society, 1998

Synopsis

Advanced packaging applications are demanding increasingly more innovative materials sets in order to ensure overall package reliability. In addition, as we migrate towards higher-density inter-connects, the assembly operation will require new processes and process materials to guarantee both performance and manufacturability. This book explores the questions of materials, processes and reliability for high-density package solutions. The book is strengthened by invited and contributed papers from a host of national and international experts. Topics include: interfacial adhesion behavior; flip-chip interconnections; high-density substrates; thermomechanical behavior and packaging reliability issues.

Edition details

• Publisher: Materials Research Society
• Publication date: 1998
• Language: English
• ISBN 10: 1558994211
• ISBN 13: 9781558994218
• Binding: Hardcover
• Number of pages: 262
• Editor: Belton Daniel J., Gaynes Michael, Jacobs Elizabeth G., Pearson Raymond, Wu Tien