Synopsis
With the increased complexity of modern integrated circuits, it is important that reliability problems be attacked properly with the appropriate tools. This volume recognizes that almost all reliability problems are materials problems, and helps to put 'reliabilty physics' on a firm scientific foundation. Topics include: electromigration; stress effects on reliability; stress and packaging; metallization; device, oxide and dielectric reliability; new investigative techniques; corrosion.
"synopsis" may belong to another edition of this title.
Book Description
With the increased complexity of modern integrated circuits, it is important that reliability problems be attacked properly with the appropriate tools. This volume recognizes that almost all reliability problems are materials problems, and helps to put 'reliabilty physics' on a firm scientific foundation. Topics include electromigration, stress and packaging, metallization and corrosion.
"About this title" may belong to another edition of this title.
Other Popular Editions of the Same Title
Search results for Materials Reliability Issues in Microelectronics: Volume...
Stock Image
Materials Reliability Issues in Microelectronics: Volume 225
Seller: Buchpark, Trebbin, Germany
Seller rating 5 out of 5 stars
Condition: Gut. Zustand: Gut | Seiten: 382 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar. Seller Inventory # 12300443/203