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Packaging of High Power Semiconductor Lasers (Micro- and Opto-Electronic Materials, Structures, and Systems) - Softcover
Synopsis
This book introduces high power semiconductor laser packaging design, examining new technologies and current applications. It details challenges as well as various packaging and testing techniques.
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About the Author
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
From the Back Cover
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
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Packaging of High Power Semiconductor Lasers
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ISBN 10: 149395590X
ISBN 13: 9781493955909
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail. 420 pp. Englisch. Seller Inventory # 9781493955909
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Packaging of High Power Semiconductor Lasers
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Taschenbuch. Condition: Neu. Packaging of High Power Semiconductor Lasers | Xingsheng Liu (u. a.) | Taschenbuch | Micro- and Opto-Electronic Materials, Structures, and Systems | xv | Englisch | 2016 | Springer | EAN 9781493955909 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Seller Inventory # 103332172
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Packaging of High Power Semiconductor Lasers
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ISBN 10: 149395590X
ISBN 13: 9781493955909
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book introduces high power semiconductor laser packaging design.The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 420 pp. Englisch. Seller Inventory # 9781493955909
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