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Three Dimensional System Integration: IC Stacking Process and Design - Softcover

 
9781441909633: Three Dimensional System Integration: IC Stacking Process and Design
Softcover
ISBN 10: 144190963X ISBN 13: 9781441909633
Publisher: Springer, 2011

This specific ISBN edition is currently not available.

Synopsis

The next step in system integration: the benefits of going 3-D.- Process technology for manufacturing Through-Silicon Vias (TSVs).- Alternative 3D integration schemes.- Manufacturing issues in 3D stacked ICs.- TSV characterization.- Physical design of 3D stacked ICs.- DRAM on logic stacking.- 3D general purpose micro-processors.- 3D system design: a holistic design approach.

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Publisher
Springer
Publication date
2011
Language
English
ISBN 10 
144190963X
ISBN 13 
9781441909633
Binding
Paperback
Number of pages
256
Editor
Papanikolaou Antonis, Soudris Dimitrios, Radojcic Riko

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Other Popular Editions of the Same Title

9781441909619: Three Dimensional System Integration: IC Stacking Process and Design

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ISBN 10:  1441909613 ISBN 13:  9781441909619
Publisher: Springer, 2010
Hardcover