Three Dimensional System Integration: IC Stacking Process and Design - Softcover

 
9781441909633: Three Dimensional System Integration: IC Stacking Process and Design
Softcover
ISBN 10: 144190963X ISBN 13: 9781441909633
Publisher: Springer, 2011

This specific ISBN edition is currently not available.

Synopsis

The next step in system integration: the benefits of going 3-D.- Process technology for manufacturing Through-Silicon Vias (TSVs).- Alternative 3D integration schemes.- Manufacturing issues in 3D stacked ICs.- TSV characterization.- Physical design of 3D stacked ICs.- DRAM on logic stacking.- 3D general purpose micro-processors.- 3D system design: a holistic design approach.

"synopsis" may belong to another edition of this title.

Publisher
Springer
Publication date
2011
Language
English
ISBN 10 
144190963X
ISBN 13 
9781441909633
Binding
Paperback
Number of pages
256
Editor
Papanikolaou Antonis, Soudris Dimitrios, Radojcic Riko

Other Popular Editions of the Same Title

9781441909619: Three Dimensional System Integration: IC Stacking Process and Design

Featured Edition

ISBN 10:  1441909613 ISBN 13:  9781441909619
Publisher: Springer, 2010
Hardcover