Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures - Softcover

Softcover

ISBN 10: 1441907858 ISBN 13: 9781441907851

Publisher: Springer, 2010

Synopsis

3D Process Technology Considerations.- Thermal and Power Delivery Challenges in 3D ICs.- Thermal-Aware 3D Floorplan.- Thermal-Aware 3D Placement.- Thermal Via Insertion and Thermally Aware Routing in 3D ICs.- Three-Dimensional Microprocessor Design.- Three-Dimensional Network-on-Chip Architecture.- PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers.- System-Level 3D IC Cost Analysis and Design Exploration.

About this title

From the Back Cover

This book presents an overview of the field of 3D IC design, with an

emphasis on electronic design automation (EDA) tools and algorithms

that can enable the adoption of 3D ICs, and the architectural

implementation and potential for future 3D system design. The aim of

this book is to provide the reader with a complete understanding of:

• the promise of 3D ICs in building novel systems that enable the chip

industry to continue along the path of performance scaling,

• the state of the art in fabrication technologies for 3D integration,

• the most prominent 3D-specific EDA challenges, along with solutions

and best practices,

• the architectural benefits of using 3D technology,

• architectural-and system-level design issues, and

• the cost implications of 3D IC design.

Three Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures is intended for practitioners in the field, researchers and graduate students seeking to know more about 3D IC design.

Edition details

• Publisher: Springer
• Publication date: 2010
• ISBN 10: 1441907858
• ISBN 13: 9781441907851
• Binding: Paperback
• Language: English
• Number of pages: 298
• Editor: Xie Yuan, Cong Jingsheng Jason, Sapatnekar Sachin