There are many benefits to using the BGA package; however, its greatest asset, the ability to provide an extremely dense array of thousands of pins, also turns out to be a tremendous problem for PCB designers. The BGA density and pin count continues to increase; yet, our ability to effectively design with these devices has not kept pace. Fortunately, significant advancements in PCB fabrication technology have enabled further miniaturization in the manufacturing process. These improvements, along with new software and design methods specifically for BGAs provide a means to successfully design using these devices. This book explores the impact of dense BGAs with high pin-count on PCB design and provides solutins for inherent design challenges and is for PCB designers who are designing boards with multiple very large BGAs.
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Charles Pfeil is an Engineering Director at Mentor Graphics, Systems Design Division. He was the original product architect for ExpeditionPCB and is an inventor of XtremePCB, TeamPCB and Xtreme AutoRoute. Charles has worked in the PCB industry for over 40 years as a designer, owner of a service bureau, and has also worked in marketing and/or engineering managemetn at Racal-Redac, ASI, Cadence, PADS and VeriBest. He may be contacted through email at charles_pfeil@mentor.com To learn more about Mentor PCB design solutions and BGAs, view the website at www.mentor.com/go/bga
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