Items related to LCP for Microwave Packages and Modules (The Cambridge...

LCP for Microwave Packages and Modules (The Cambridge RF and Microwave Engineering Series) - Hardcover

Book 7 of 20: Cambridge RF and Microwave Engineering

Anh-Vu H. Pham , Morgan J. Chen , Kunia Aihara

 
9781107003781: LCP for Microwave Packages and Modules (The Cambridge RF and Microwave Engineering Series)
Hardcover
ISBN 10: 1107003784 ISBN 13: 9781107003781
Publisher: Cambridge University Press, 2012

Synopsis

A comprehensive overview of RF microelectronic design using Liquid Crystal Polymer (LCP) at package, component and system levels.

"synopsis" may belong to another edition of this title.

About the Authors

Anh-Vu H. Pham is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published around 100 peer-reviewed papers, several book chapters and one book, is currently the Vice Chair of IEEE International Microwave Symposium Technical Committee on Power Amplifiers and Integrated Devices and a Microwave Distinguished Lecturer of the IEEE MTT for the term 2010–2012.

Morgan J. Chen is a Staff Engineer at FutureWei Technologies, an R&D US subsidiary of Huawei Technologies. He has worked in both academia and industry for over a decade, advancing high-frequency packaging from DC to past 60 GHz.

Kunia Aihara is an Electronics Engineer in the RF/EO Subsystems branch of the Air Force Research Laboratory.

"About this title" may belong to another edition of this title.

Publisher
Cambridge University Press
Publication date
2012
Language
English
ISBN 10 
1107003784
ISBN 13 
9781107003781
Binding
Hardcover
Number of pages
266