Materials and Processes for Wireless Communications: v. 53 (Ceramic Transactions) - Hardcover

Negas, T.; Ling, Hung C.

Hardcover

ISBN 10: 0944904947 ISBN 13: 9780944904947

Publisher: American Ceramic Society, 1995

Synopsis

Introducing ceramicists to the field of wireless communication, 18 papers cover applications, measurements, designs, and materials. The topics include applications in high-volume microwaves and portable radios, microwave measurement of the complex permittivity and permeability of materials, ceramic-filled transmission lines for circuit miniaturization, the numerical simulation of electrical characteristics of multilayer ceramic capacitors, and the densification behavior of metal and dielelectric films on rigid substrates. Reproduced from typescripts. Annotation copyright Book News, Inc. Portland, Or.

About this title

Synopsis

The field of hybrid microelectronics is a multibillion-dollar venue for advanced electronic materials development. In a broad view handling of this topic, the reader will find papers ranging from ferrites to titanates to thick film technology. This book provides insight into activities in modern applied ceramic technology in hybrid microelectronic structures. An area of enormous importance and continued growth, this topic merits ongoing coverage by ACerS and should be of great interest to those working in powders, dielectrics, thin and thick films, substrate development and sensor design. Proceedings of the Symposium on Materials and Processes for Wireless Communication, held at The American Ceramic Society Electronics Division Meeting with the International Society for Hybrid Microelectronics, Nov. 15-17, 1994, in Boston. Topics Covered: Applications and measurements Designs and Materials.

Edition details

• Publisher: American Ceramic Society
• Publication date: 1995
• Language: English
• ISBN 10: 0944904947
• ISBN 13: 9780944904947
• Binding: Hardcover
• Number of pages: 10
• Editor: Ling Hung