Ball Grid Array and Fine Pitch Peripheral Interconnections: Handbook of Technology and Applications for Microelectronics/Electronics Manufacturing - Hardcover
Synopsis
Subtitle: Handbook of Technology & Applications for Microelectronics/Electronics Manufacturing. The scope of the technique is drawn, incl. Quad Flat Packs & cost considerations noted. Types of IC package are treated, P-, C-,M-, T-, and μ-BGA. Solder material characteristics and assembly processes are discussed in depth. As are problems, defects and troubleshooting. Inspection, rework and repair and reliablity of solder interconnects are considered in detail. Some present and future perspectives are considered.
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Ball Grid Array and Fine Pitch Peripheral Interconnections : A Handbook of Technology and Applications for Microelectronics/Electronics Manufacturing
Published by
Electrochemical Publications Limited, 1995
ISBN 10: 0901150290
ISBN 13: 9780901150295
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Hardcover
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