A comprehensive guide to this crucial technology sets out its many advantages and compares it with other IC packaging options. Covered in detail are substrates, design & assembly, wave soldering, solder pastes & their application, reflow soldering using radiant heat or fluid heat transfer. Other means of attachment are reviewed. Solderability and underlying physicochemical phenomena, test methods are covered in depth. Solder fillets, solder metallurgy and fatigue in solder joints. Post-assembly operations, incl. cleaning processes and cleanliness measurement. Protective (conformal) coatings, quality & reliability and economic trends conclude the work.
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