Whether you are designing a new system or troubleshooting a current one, this ingenious text offers a wealth of valuable information. The author focuses on reliability problems and the design of systems with incomplete criteria and components and provides a simple approach for estimating thermal and mechanical characteristics of electronic systems.
Practical Guide to the Packaging of Electronics discusses
"synopsis" may belong to another edition of this title.
"Anyone looking to learn quickly about the fundamentals of basic thermal heat transfer and vibration needs this book. The author has written a concise practical book intended for all engineers who need to understand the fundamentals of heat transfer and mechanical vibration, especially in electronics and electronics packaging. Engineers who need to perform back-of-the-envelope calculations for heat transfer or vibration problems will find this book to be an excellent resource. The material is written for quick learning and is geared for applying to practical problems encountered by engineers." - IEEE Electrical Insulation, Vol. 20, No. 2, March/April 2004 Promo Copy
"About this title" may belong to another edition of this title.
Seller: Better World Books Ltd, Dunfermline, United Kingdom
Condition: Very Good. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Seller Inventory # GRP91312998
Quantity: 1 available
Seller: Basi6 International, Irving, TX, U.S.A.
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service. Seller Inventory # ABEOCT25-283518
Seller: Basi6 International, Irving, TX, U.S.A.
Condition: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service. Seller Inventory # POD-661900