Volume 10.04 features specifications, test methods, practices, and guides covering; innerlayer interconnections and bonding; materials and processes for vacuum tubes; electronic device characterization; hermetic seals; hybrid circuits and substrates; microelectronic packaging; leak testing; electro-optics; sputtering targets; and electronic thin films. Volume 10.05 includes standards that examine; optical properties; semiconductor properties; electrical properties of silicon; impurities and contaminants in silicon; mechanical properties of silicon, membrane switches; photolithography; and environmental contamination control.
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