Advances in Thermal Modelling of Electronic Components and Systems: v. 2 - Hardcover

Hardcover

ISBN 10: 0791800156 ISBN 13: 9780791800157

Publisher: Amer Soc of Mechanical Engineers, 1990

Synopsis

The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information on: Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.

About this title

About the Author

ALLAN D. KRAUS is Principal Associate of Allan D. Kraus Associates, a consulting firm in Pacific Grove, California. He is a former faculty member in the Electrical Engineering Department of the Naval Postgraduate School in Monterey, California.

AVRAM BAR-COHEN is Professor and Director of the Thermodynamics and Heat Transfer Division in the Mechanical Engineering Department of the University of Minnesota.

Kraus, ADK Associates, Aurora, Ohio.

Edition details

• Publisher: Amer Soc of Mechanical Engineers
• Publication date: 1990
• Language: English
• ISBN 10: 0791800156
• ISBN 13: 9780791800157
• Binding: Hardcover
• Editor: Bar-Cohen Avram