Compiles translations of articles previously available only in the Japanese-language journal Surface Mount Technology . Coverage is grouped into six parts: trends in surface mount technology (SMT), SMT equipment, developments in solder technology, tape automated bending, chips on board technology, and multichip modules and printed circuit board technologies. The articles are extensively furnished with graphs, tables, figures and b&w photos a few of which are of inferior quality. Annotation copyright Book News, Inc. Portland, Or.
"synopsis" may belong to another edition of this title.
Compiles translations of articles previously available only in the Japanese-language journal Surface Mount Technology . Coverage is grouped into six parts: trends in surface mount technology (SMT), SMT equipment, developments in solder technology, tape automated bending, chips on board technology, and multichip modules and printed circuit board tec
"About this title" may belong to another edition of this title.
Seller: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less. Seller Inventory # G0780304071I4N00
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Condition: Fine. No Jacket. Small quarto, hardcover, fine in red boards. No dj. Illustrated by B & W drawings & photos. translated, preeminent articles from the Journal "Surface Mount Technology", published in Japanese. Translated by TechSearch International. 315 pp. including index. Giftable. Discusses trends in surface mount tech, SMT equipment, solder tech., tape automated bonding, chip on board, multichip modules and printed circuit board tech., etc. Book. Seller Inventory # 42116
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