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Synopsis
Addresses methods for measuring the properties of IC packages. Chapters include examples of the different analytical techniques used to measure the IC characteristics, and how to identify problems in IC packaging.
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Synopsis
Addresses methods for measuring the properties of IC packages. Chapters include examples of the different analytical techniques used to measure the IC characteristics, and how to identify problems in IC packaging.
About the Author
Thomas M. Moore
Robert G. McKenna
"About this title" may belong to another edition of this title.
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Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series)
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Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series)
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Characterization of Integrated Circuit Packaging Materials
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Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series)
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Characterization of Integrated Circuit Packaging Materials (Materials Characterization Series)
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