Synopsis
This book presents, for the first time, a comprehensive survey ofanalytical techniques currently used in support of all stages ofmicroelectronic materials and device processing. The diversity oftopics covered in this book has been achieved by bringing togetheran international field of authors contributing specializedindividual chapters. This has ensured that each technique isdiscussed in detail giving in-depth treatments of the subjectmatter. A particularly helpful feature in this book is the concisetechnical summary given at the end of each section. Four majorareas are considered in this volume:
* Bulk analysis of microelectronic materials
* Analysis of surfaces, interfaces and thin films
* Structure analysis on an atomic scale
* Characterization of physical, electrical and topographicfeatures
Complete with over 400 illustrations, this volume is anindispensible guide to analytical support for the microelectronicindustry.
"synopsis" may belong to another edition of this title.
About the Author
M. Grasserbauer and H. W. Werner are the authors of Analysis of Microelectronic Materials and Devices, published by Wiley.
From the Back Cover
This book presents, for the first time, a comprehensive survey of analytical techniques currently used in support of all stages of microelectronic materials and device processing. The diversity of topics covered in this book has been achieved by bringing together an international field of authors contributing specialized individual chapters. This has ensured that each technique is discussed in detail giving in-depth treatments of the subject matter. A particularly helpful feature in this book is the concise technical summary given at the end of each section. Four major areas are considered in this volume:
- Bulk analysis of microelectronic materials
- Analysis of surfaces, interfaces and thin films
- Structure analysis on an atomic scale
- Characterization of physical, electrical and topographic features
From the Inside Flap
This book presents, for the first time, a comprehensive survey of analytical techniques currently used in support of all stages of microelectronic materials and device processing. The diversity of topics covered in this book has been achieved by bringing together an international field of authors contributing specialized individual chapters. This has ensured that each technique is discussed in detail giving in-depth treatments of the subject matter. A particularly helpful feature in this book is the concise technical summary given at the end of each section. Four major areas are considered in this volume:
- Bulk analysis of microelectronic materials
- Analysis of surfaces, interfaces and thin films
- Structure analysis on an atomic scale
- Characterization of physical, electrical and topographic features
"About this title" may belong to another edition of this title.
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