This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections
In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.
Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:
*
Preliminary Concepts
*
Parasitic Resistances, Capacitances, and Inductances
*
Interconnection Delays
*
Crosstalk Analysis
*
Electromigration-Induced Failure Analysis
*
Future Interconnections
High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
"synopsis" may belong to another edition of this title.
AShok k. Goel, PhD, is Associate Professor of Electrical Engineering at Michigan Technological University. He is the author of more than thirty journal publications and numerous conference proceedings. His research interests include nanotechnology circuit design, high-speed VLSI interconnections, device physics and modeling, and semiconductor TCAD.
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections
In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.
Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:
Preliminary Concepts
Parasitic Resistances, Capacitances, and Inductances
Interconnection Delays
Crosstalk Analysis
Electromigration-Induced Failure Analysis
Future Interconnections
High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections
In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk.
Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include:
Preliminary Concepts
Parasitic Resistances, Capacitances, and Inductances
Interconnection Delays
Crosstalk Analysis
Electromigration-Induced Failure Analysis
Future Interconnections
High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
"About this title" may belong to another edition of this title.
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Hardcover. Condition: new. Hardcover. This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering. Updated to reflect the major developments in field of VLSI interconnections over the past decade, this Second Edition of High-Speed VLSI Interconnections includes new sections on Parasitic Inductances, Nanotechnology circuit interconnects, Electromigrations in the copper interconnections, and Optical Interconnections. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Seller Inventory # 9780471780465