Advanced Integrated Communication Microsystems (Wiley Series in Microwave and Optical Engineering) - Hardcover

Laskar, Joy; Chakraborty, Sudipto; Pham, Anh-Vu; Tantzeris, Manos M.

Hardcover

ISBN 10: 0471709603 ISBN 13: 9780471709602

Publisher: Wiley-IEEE Press, 2009

Synopsis

Learn the fundamentals of integrated communication microsystems

Advanced communication microsystems―the latest technology to emerge in the semiconductor sector after microprocessors―require integration of diverse signal processing blocks in a power-efficient and cost-effective manner. Typically, these systems include data acquisition, data processing, telemetry, and power management. The overall development is a synergy among system, circuit, and component-level designs with a strong emphasis on integration.

This book is targeted at students, researchers, and industry practitioners in the semiconductor area who require a thorough understanding of integrated communication microsystems from a developer's perspective. The book thoroughly and carefully explores:

• Fundamental requirements of communication microsystems

• System design and considerations for wired and wireless communication microsystems

• Advanced block-level design techniques for communication microsystems

• Integration of communication systems in a hybrid environment

• Packaging considerations

• Power and form factor trade-offs in building integrated microsystems

Advanced Integrated Communication Microsystems is an ideal textbook for advanced undergraduate and graduate courses. It also serves as a valuable reference for researchers and practitioners in circuit design for telecommunications and related fields.

About this title

About the Author

Joy Laskar, PhD, holds the Schlumberger Chair in Microelectronics in the School of Electrical and Computer Engineering at Georgia Tech. He is also founder and Director of the Georgia Electronic Design Center, where he heads a research group that focuses on the integration of high-frequency mixed-signal electronics for next-generation wireless and wire line systems.

Sudipto Chakraborty, PhD, is a research staff member at Texas Instruments, where he is involved in architecting and designing advanced system-on-chip mixed signal systems using silicon-based technologies. He has authored or coauthored several technical articles, journals, and books, and has served on the technical program committee for various IEEE conferences and journals.

Manos M. Tentzeris, PhD, is an Associate Professor in the School of Electrical and Computer Engineering at Georgia Tech. He is also the Associate Director of the Georgia Electronic Design Center in the area of RFID/Sensors and heads the ATHENA group, which focuses on 3D integration and packaging, multiband/ultrawideband antennas and antenna arrays, wearable/flexible inkjet-printed electronics, CNT/graphene, and integrable power scavenging.

Franklin Bien, PhD, is an Assistant Professor at Ulsan National Institute of Science and Technology (UNIST), Korea, home for Hyundai/Kia Motor Company. He cofounded and leads the UNIST Electronic Design Center (UEDC) focusing on analog/mixed-signal and RF ICs for wireless communications and ubiquitous connectivity for automotive information technology applications.

Anh-Vu Pham, PhD, is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published extensively and received the National Science Foundation CAREER Award in 2001 and the 2008 Outstanding Young Engineer Award from the IEEE Microwave Theory and Techniques Society. He cofounded RF Solutions and PlanarMag, Inc., and has been an active consultant for industry.

From the Back Cover

Learn the fundamentals of integrated communication microsystems

Advanced communication microsystems the latest technology to emerge in the semiconductor sector after microprocessors require integration of diverse signal processing blocks in a power-efficient and cost-effective manner. Typically, these systems include data acquisition, data processing, telemetry, and power management. The overall development is a synergy among system, circuit, and component-level designs with a strong emphasis on integration.

This book is targeted at students, researchers, and industry practitioners in the semiconductor area who require a thorough understanding of integrated communication microsystems from a developer's perspective. The book thoroughly and carefully explores:

• Fundamental requirements of communication microsystems

• System design and considerations for wired and wireless communication microsystems

• Advanced block-level design techniques for communication microsystems

• Integration of communication systems in a hybrid environment

• Packaging considerations

• Power and form factor trade-offs in building integrated microsystems

Advanced Integrated Communication Microsystems is an ideal textbook for advanced undergraduate and graduate courses. It also serves as a valuable reference for researchers and practitioners in circuit design for telecommunications and related fields.

From the Inside Flap

Learn the fundamentals of integrated communication microsystems

Advanced communication microsystems—the latest technology to emerge in the semiconductor sector after microprocessors—require integration of diverse signal processing blocks in a power-efficient and cost-effective manner. Typically, these systems include data acquisition, data processing, telemetry, and power management. The overall development is a synergy among system, circuit, and component-level designs with a strong emphasis on integration.

This book is targeted at students, researchers, and industry practitioners in the semiconductor area who require a thorough understanding of integrated communication microsystems from a developer's perspective. The book thoroughly and carefully explores:

• Fundamental requirements of communication microsystems

• System design and considerations for wired and wireless communication microsystems

• Advanced block-level design techniques for communication microsystems

• Integration of communication systems in a hybrid environment

• Packaging considerations

• Power and form factor trade-offs in building integrated microsystems

Advanced Integrated Communication Microsystems is an ideal textbook for advanced undergraduate and graduate courses. It also serves as a valuable reference for researchers and practitioners in circuit design for telecommunications and related fields.

Edition details

• Publisher: Wiley-IEEE Press
• Publication date: 2009
• Language: English
• ISBN 10: 0471709603
• ISBN 13: 9780471709602
• Binding: Hardcover
• Edition number: 1
• Number of pages: 496