Soldering Processes and Equipment - Hardcover

 
9780471591672: Soldering Processes and Equipment
Hardcover
ISBN 10: 047159167X ISBN 13: 9780471591672
Publisher: Wiley-Interscience, 1993

Synopsis

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.

"synopsis" may belong to another edition of this title.

About the Author

Michael Pecht is a tenured faculty member with a joint appointment in Systems Research and Mechanical Engineering, and the Director of the CALCE Electronic Packaging Research Center at the University of Maryland. He has an MS in electrical engineering and an MS and PhD in engineering mechanics from the University of Wisconsin. He is a Professional Engineer and an IEEE Fellow. He serves on the board of advisors for various companies and was a West-inghouse Professor. He is the chief editor of the IEEE Transactions on Reliability, and a section editor for the Society of Automotive Engineering.

"About this title" may belong to another edition of this title.

Publisher
Wiley-Interscience
Publication date
1993
Language
English
ISBN 10 
047159167X
ISBN 13 
9780471591672
Binding
Hardcover
Edition number
1
Number of pages
312
Editor
Pecht Michael G.