This handbook for packaging designers and students contains 550 patterns for packages, containers and point-of-sale displays made of paper, paperboard and corrugated cardboard. It provides patterns, drawings of assembled packages and detailed drawings of special application features. The patterns are intended to be traced or photocopied for use by designers. They are supplemented with appropriate technical data including size restrictions, materials, adhesives and possible applications. These applications range from cartons for major appliances to cosmetic packaging.
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The best competitive advantage in a single volume Fifteen years after the first edition of this landmark resource, The Packaging Designer′s Book of Patterns continues its long tradition as a useful tool in the ever–changing world of packaging design. This Third Edition features more than fifty new patterns and new material on the latest advances in closures. This unparalleled, hands–on resource gives designers the advantage they need to successfully meet any packaging challenge. Every pattern has been test–constructed to verify dimensional accuracy and is ready to be traced, scanned, or photocopied for immediate use. The patterns can be scaled to suit particular specifications many are easily converted to alternate uses and most details are easily customizable. This new Third Edition includes: A broad array of patterns for folding cartons, trays, tubes, sleeves, wraps, folders, corrugated cartons, point–of–purchase displays, and more Patterns that are based on the use of 100% recyclable paper materials Glue areas on patterns that are clearly indicated with black dots The Packaging Designer′s Book of Patterns, Third Edition is a powerful tool to help packaging designers gain an edge over the competition.
Now retired, GEORGE L. WYBENGA was professor in the Packaging Design Program at the Fashion Institute of Technology and succeeded Lįszlo Roth as chairperson. He remains active as a consultant to the packaging industry. The late LĮSZLO ROTH was chairperson of the Packaging Design Program at the Fashion Institute of Technology in New York.
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