Modern Electroplating (The ECS Series of Texts and Monographs) - Hardcover

 
9780471168249: Modern Electroplating (The ECS Series of Texts and Monographs)
Hardcover
ISBN 10: 0471168246 ISBN 13: 9780471168249
Publisher: Wiley–Blackwell, 2000

Synopsis

A new collection of authoritative contributions on the state of the art of electrochemical deposition
Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting–edge topics, from electrodeposition of semiconductors to environmental considerations.
Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up–to–date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next–generation technologies such as copper interconnect. Coverage includes:
∗ Electrodeposition of various metals and metal alloys
∗ Electrodeposition of semiconductors and electrodeposition on nonconductors
∗ Electrodeposition of conductive polymers
∗ Electroless deposition of various metals and alloys
∗ Preparation procedures for deposition
∗ Manufacturing technologies, monitoring, testing, and control
∗ Deposition and the environment

"synopsis" may belong to another edition of this title.

About the Author

MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada.

MILAN PAUNOVIC, PhD, is a researcher at IBM, T. J. Watson Research Center, Yorktown Heights, New York.

From the Back Cover

A new collection of authoritative contributions on the state of the art of electrochemical deposition

Since the last edition of Modern Electroplating was published over a quarter century ago, electrochemical deposition has evolved into a mature science, with many new and potential applications. To address these developments, Modern Electroplating, Fourth Edition presents an entirely new collection of contributions on a wide range of cutting–edge topics, from electrodeposition of semiconductors to environmental considerations.

Geared to experienced deposition practitioners and novices alike, the new edition provides clear, thorough, up–to–date explanations of the principles and applications of highly relevant deposition techniques. It not only replaces the Third Edition, a very useful resource on electroplating processes, but, in addition, highlights the transition in the electronics industry from physical to electrochemical methods, especially with regard to next–generation technologies such as copper interconnect. Coverage includes:
∗ Electrodeposition of various metals and metal alloys
∗ Electrodeposition of semiconductors and electrodeposition on nonconductors
∗ Electrodeposition of conductive polymers
∗ Electroless deposition of various metals and alloys
∗ Preparation procedures for deposition
∗ Manufacturing technologies, monitoring, testing, and control
∗ Deposition and the environment

"About this title" may belong to another edition of this title.

Publisher
Wiley–Blackwell
Publication date
2000
Language
English
ISBN 10 
0471168246
ISBN 13 
9780471168249
Binding
Hardcover
Edition number
4
Number of pages
888
Editor
Schlesinger Mordechay, Paunovic Milan