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Synopsis
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
"synopsis" may belong to another edition of this title.
Product Description
Chip on Board A guide to the COB technology. It is suitable for professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems. Full description
"About this title" may belong to another edition of this title.
- PublisherSpringer
- Publication date1994
- ISBN 10 0442014414
- ISBN 13 9780442014414
- BindingHardcover
- LanguageEnglish
- Number of pages576
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering) [Hardcover] Lau, John H.
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Chip on Board: Technology for Multichip Modules
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Gebunden. Condition: New. This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and. Seller Inventory # 458435639
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
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Chip on Board : Technology for Multichip Modules
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Buch. Condition: Neu. Neuware - This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection. Seller Inventory # 9780442014414
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