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Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series) - Hardcover
Book 30 of 80: Mechanical Engineering
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This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.
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Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series)
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Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series)
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Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series)
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Structural Analysis of Printed Circuit Board Systems
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Springer New York Jun 1993, 1993
ISBN 10: 0387979395
ISBN 13: 9780387979397
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. 316 pp. Englisch. Seller Inventory # 9780387979397
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Structural Analysis of Printed Circuit Board Systems
Seller: Books Puddle, New York, NY, U.S.A.
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Condition: New. pp. 316. Seller Inventory # 26315615
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Structural Analysis of Printed Circuit Board Systems
Print on DemandSeller: preigu, Osnabrück, Germany
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Buch. Condition: Neu. Structural Analysis of Printed Circuit Board Systems | Peter A. Engel | Buch | Mechanical Engineering Series | xix | Englisch | 1993 | Springer | EAN 9780387979397 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. Seller Inventory # 102941745
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Structural Analysis of Printed Circuit Board Systems
Published by
Springer New York, Springer Jun 1993, 1993
ISBN 10: 0387979395
ISBN 13: 9780387979397
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Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
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Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 316 pp. Englisch. Seller Inventory # 9780387979397
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Structural Analysis of Printed Circuit Board Systems
Print on DemandSeller: Majestic Books, Hounslow, United Kingdom
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Condition: New. Print on Demand pp. 316 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam. Seller Inventory # 7565056
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Structural Analysis of Printed Circuit Board Systems
Print on DemandSeller: Biblios, Frankfurt am main, HESSE, Germany
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Condition: New. PRINT ON DEMAND pp. 316. Seller Inventory # 18315605
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Structural Analysis of Printed Circuit Board Systems
Seller: AHA-BUCH GmbH, Einbeck, Germany
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction What are the elastic parameters that determine whether a component will survive a certain acceleration After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards. Seller Inventory # 9780387979397