Reduced Thermal Processing for ULSI: 207 (NATO Science Series B) - Hardcover

Hardcover

ISBN 10: 0306433826 ISBN 13: 9780306433825

Publisher: Kluwer Academic/Plenum Publishers, 1990

Synopsis

As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.

About this title

Synopsis

Addresses three broad but interrelated areas. The first is the subject of rapid thermal processing, a technology that minimizes processing time while relaxing the constraints on high temperature. The second area presents advances in equipment design and performance of rapid thermal processing equipment. The third area is devoted to novel microelect

Edition details

• Publisher: Kluwer Academic/Plenum Publishers
• Publication date: 1990
• Language: English
• ISBN 10: 0306433826
• ISBN 13: 9780306433825
• Binding: Hardcover
• Number of pages: 450
• Editor: Levy R.A.