This edition includes new material on the devices used for optical fibre communication, on the new semiconductor alloys, and on the properties of multiple thin layers of semiconductor. The treatment of MOS devices is brought into line with that used in the SPICE circuit simulation technique.
"synopsis" may belong to another edition of this title.
This edition includes new material on the devices used for optical fibre communication, on the new semiconductor alloys, and on the properties of multiple thin layers of semiconductor. The treatment of MOS devices is brought into line with that used in the SPICE circuit simulation technique.
"About this title" may belong to another edition of this title.
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