Hardcover

ISBN 10: 0130669466 ISBN 13: 9780130669469

Publisher: Prentice Hall, 2003

This book describes in the simplest possible terms, the signal integrity problems and the fundamental principles needed to understand how the physical design influences signal integrity. Most easily defined, signal integrity is all about how the physical design of the interconnects -- printed circuit board traces, connectors, IC packages and cables -- corrupt the perfect, pristine signals coming off the chips. The electrical properties of the interconnects play a key role in all electronic products operating above 50 MHz clock frequency, such as computers, wireless, rf and telecommunications products. Interconnects can degrade the electrical performance of a system in four ways: ringing, cross talk, noise in the power and ground distribution network and electromagnetic interference (EMI). These signal integrity problems can be reduced to acceptable levels by careful design of the circuit board layout, materials selection and component design and selection. Any product designer that touches the product can have an impact on signal integrity. The key differentiator between our book and all the others written on signal integrity, is the starting level for the material.Most books either present a lot of mathematical derivation or present formulas as facts, merely describing what they are. Bogatin's book offers explanations that will feed the intuition of the engineers, without hiding behind the equations.

From the Back Cover:

The complete guide to understanding and designing for signal integrity

Suitable for even non-specialists, Signal Integrity—Simplified offers a comprehensive, easy-to-follow look at how physical interconnects affect electrical performance. World-class engineer Eric Bogatin expertly reviews the root causes of the four families of signal integrity problems and offers solutions to design them out early in the design cycle. Coverage includes:

• An introduction to signal integrity and physical design
• A fundamental understanding of what bandwidth, inductance, and characteristic impedance really mean
• Analysis of resistance, capacitance, inductance, and impedance
• The four important practical tools used to solve signal integrity problems: rules of thumb, analytic approximations, numerical simulation, and measurements
• The effect of the physical design of interconnects on signal integrity
• Solutions that do not hide behind mathematical derivations
• Recommendations for design guidelines to improve signal integrity, and much more

Unlike related books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Specially designed for everyone in the electronics industry, from electrical engineers to product managers, Signal Integrity—Simplified will prove itself an invaluable resource for helping you find and fix signal integrity problems before they become problems.

About the Author:

ERIC BOGATIN, Chief Technology Officer at GigaTest Labs, has over 23 years of experience in the microelectronics industry. Before joining GigaTest, he worked with AT&T Bell Labs, Raychem Corporation, Sun Microsystems, and other leading microelectronics manufacturers. He received his B.S. degree in physics at MIT and his M.S. and Ph.D. degrees from the University of Arizona, Tucson, in 1980. Over the years, he has taught over 3,000 engineers and authored over 100 technical articles and books on signal integrity and interconnect design.