Reliability and Failure of Electronic Materials and Devices, Second Edition

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9780120885749: Reliability and Failure of Electronic Materials and Devices, Second Edition

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.

  • Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints
  • New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections
  • New chapter on testing procedures, sample handling and sample selection, and experimental design
  • Coverage of new packaging materials, including plastics and composites

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Book Description:

A nearly 50% revision of this classic materials reference work

From the Back Cover:

This book introduces the reader to the widely dispersed reliability literature of microelectronic and electro-optical devices. It integrates a treatment of chip models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying book thread concerns product defects-their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The book can be used as an advanced undergraduate/graduate textbook for materials scientists and electrical engineers, and as a reference for reliability professionals.

KEY FEATURES
* Discuss reliability and failure on both the chip and packaging levels
* Handles the role of defects in yield and reliability
* Includes a tutorial chapter on the mathematics of reliability
* Focuses on electomigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage, and the mechanical failure of packages, contacts, and solder joints
* Considers defect detection methods and failure analysis techniques

ABOUT THE AUTHOR
Dr. Milton Ohring, author of two previously acclaimed Academic Press books, The Materials Science of Thin Films (1992), and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain deeper physical understanding of failure mechnanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.

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Book Description Elsevier Science Publishing Co Inc, United States, 2014. Hardback. Book Condition: New. 2nd Revised edition. Language: English . Brand New Book. Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Bookseller Inventory # AAU9780120885749

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Book Description Elsevier Science Publishing Co Inc, United States, 2014. Paperback. Book Condition: New. 2nd edition. Language: English . Brand New Book. Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Bookseller Inventory # AAU9780120885749

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Book Description Academic Press, 2014. Book Condition: New. Offers coverage of some of the major topics related to the performance and failure of materials used in electronic devices and electronics packaging. This book explains the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects and radiation damage. Num Pages: 758 pages, colour illustrations. BIC Classification: TD; TJFC. Category: (P) Professional & Vocational. Dimension: 232 x 165 x 46. Weight in Grams: 1224. . 2014. 2nd Edition. Hardcover. . . . . . Bookseller Inventory # V9780120885749

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Book Description Academic Press. Book Condition: New. Offers coverage of some of the major topics related to the performance and failure of materials used in electronic devices and electronics packaging. This book explains the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects and radiation damage. Num Pages: 758 pages, colour illustrations. BIC Classification: TD; TJFC. Category: (P) Professional & Vocational. Dimension: 232 x 165 x 46. Weight in Grams: 1224. . 2014. 2nd Edition. Hardcover. . . . . Books ship from the US and Ireland. Bookseller Inventory # V9780120885749

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