System on Package: Miniaturization of the Entire System (ELECTRONICS) - Hardcover

Tummala, Rao

 
9780071459068: System on Package: Miniaturization of the Entire System (ELECTRONICS)
Hardcover
ISBN 10: 0071459065 ISBN 13: 9780071459068
Publisher: McGraw Hill, 2008

Synopsis

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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.

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About the Author

Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM.

"About this title" may belong to another edition of this title.

Publisher
McGraw Hill
Publication date
2008
Language
English
ISBN 10 
0071459065
ISBN 13 
9780071459068
Binding
Hardcover
Number of pages
785