Fundamentals of Microsystems Packaging - Hardcover

Tummala, Rao

Hardcover

ISBN 10: 0071371699 ISBN 13: 9780071371698

Publisher: McGraw-Hill Education, 2001

Synopsis

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A rigorous and thorough introduction to electronic packaging technologies
The only book to teach microsystems packaging--written by the field's leading authorThis is the book that engineers, technicians, and students want―the first to teach microsystems packaging from the ground up. Rao Tummala’s one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It’s the only book to do so. This much-needed tool features:

*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.
*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies―wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing
*Hundreds of explanatory two-color illustrations
*Self-test problems and solutions in every chapter
*Glossary
*The best way to learn microsystems packaging through self-study or in a classroom―and the most comprehensive on-the-job reference

MICROSystems PACKAGINGFROM THE GROUND UP

About this title

From the Back Cover

A rigorous and thorough introduction to electronic packaging technologies
The only book to teach microsystems packaging--written by the field's leading authorThis is the book that engineers, technicians, and students want--the first to teach microsystems packaging from the ground up. Rao Tummala's one-stop Fundamentals to Microsystems Packaging covers the field from wafer to systems, including every major contributing technology. It's the only book to do so. This much-needed tool features:

*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.
*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies--wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing
*Hundreds of explanatory two-color illustrations
*Self-test problems and solutions in every chapter
*Glossary
*The best way to learn microsystems packaging through self-study or in a classroom--and the most comprehensive on-the-job reference

MICROSystems PACKAGINGFROM THE GROUND UP

Synopsis

This is the only book to teach microsystems packaging - written by the field's leading author. This is the book that engineers, technicians, and students want - the first to teach microsystems packaging from the ground up. Rao Tummala's one-stop "Fundamentals to Microsystems Packaging" covers the field from wafer to systems, including every major contributing technology. It's the only book to do so.This much-needed tool features: a comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems; rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology; easy-to-read schematics and block diagrams; fundamental approaches to all system issues; examples of all common configurations and technologies - wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others; details on chip-to-board connections, sealing and encapsulation, and manufacturing processes; basics of electrical and reliability testing; hundreds of explanatory two-color illustrations; self-test problems and solutions in every chapter; and, glossary.

This title provides the best way to learn microsystems packaging through self-study or in a classroom - and the most comprehensive on-the-job reference. It covers MICROSystems packaging from the ground up.

Edition details

• Publisher: McGraw-Hill Education
• Publication date: 2001
• ISBN 10: 0071371699
• ISBN 13: 9780071371698
• Binding: Hardcover
• Language: English
• Number of pages: 967