Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations.
"synopsis" may belong to another edition of this title.
Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies. (Sci-Tech Book News 20041201)
"About this title" may belong to another edition of this title.
Seller: World of Books (was SecondSale), Montgomery, IL, U.S.A.
Hardback. Condition: Good. Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations. Seller Inventory # 00110862860
Seller: World of Books (was SecondSale), Montgomery, IL, U.S.A.
Hardback. Condition: Very Good. Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations. Seller Inventory # 00108949801
Seller: World of Books Inc, Montgomery, IL, U.S.A.
Hardback. Condition: Very Good. Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations. Seller Inventory # CIN0070266948VG
Seller: World of Books Inc, Montgomery, IL, U.S.A.
Hardback. Condition: Good. Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations. Seller Inventory # CIN0070266948G
Seller: Better World Books, Mishawaka, IN, U.S.A.
Condition: Good. 2nd Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Seller Inventory # 5907654-6
Seller: Greenworld Books, Arlington, TX, U.S.A.
Condition: very_good. Fast Free Shipping â" Very Good condition book with a firm cover and clean pages. Shows normal use and some light wear or limited notes markings. A solid, nice copy to enjoy. Seller Inventory # GWV.0070266948.VG
Seller: HPB-Red, Dallas, TX, U.S.A.
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Seller Inventory # S_386818827
Seller: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less. Seller Inventory # G0070266948I4N00
Seller: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less. Seller Inventory # G0070266948I3N00
Seller: Orphans Treasure Box, Champaign, IL, U.S.A.
Hardcover. Condition: Very Good. Ships quickly. Mild shelf/reading wear. Orphans Treasure Box sells books to raise money for orphans and vulnerable kids. Seller Inventory # 2MG-10192021-169