Items related to Electronic Packaging and Interconnection Handbook

Electronic Packaging and Interconnection Handbook - Hardcover

Harper, Charles A.

 
9780070266940: Electronic Packaging and Interconnection Handbook
Hardcover
ISBN 10: 0070266948 ISBN 13: 9780070266940
Publisher: McGraw-Hill Inc.,US, 1996

Synopsis

Covering the electronic packaging industry from design to test, this text includes new technologies in a fast changing field. With over 50 per cent new material, this edition presents coverage of interconnection technologies, multichip modules, ball grid arrays and other innovations.

"synopsis" may belong to another edition of this title.

Review

Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies. (Sci-Tech Book News 20041201)

From the Publisher

  • The field's only comprehensive reference
  • MEMs packaging
  • Optoelectronic packaging
  • Ball grid array, flip chip, and direct chip attach

    • "About this title" may belong to another edition of this title.

    Publisher
    McGraw-Hill Inc.,US
    Publication date
    1996
    Language
    English
    ISBN 10 
    0070266948
    ISBN 13 
    9780070266940
    Binding
    Hardcover
    Edition number
    2
    Number of pages
    900