3D Microelectronic Packaging

Book 66 of 72: Springer Series in Advanced Microelectronics

Yan Li

ISBN 10: 9811570922 ISBN 13: 9789811570926
Published by Springer, Springer Nov 2021, 2021
Language: English
Condition: New Soft cover

Sold by buchversandmimpf2000, Emtmannsberg, BAYE, Germany

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New - Soft cover

Condition: New

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