3D-MID: Three-Dimensional Molded Interconnect Devices: Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers

Frank, Jörg

ISBN 10: 1569905517 ISBN 13: 9781569905517
Published by Hanser Publications, 2014
Language: English
Condition: New Hardcover

Sold by Ria Christie Collections, Uxbridge, United Kingdom

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