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Published by Springer, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Seller: HPB-Red, Dallas, TX, U.S.A.
Book
paperback. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!.
Published by Springer, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Book Print on Demand
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Published by Springer 2010-10-29, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Seller: Chiron Media, Wallingford, United Kingdom
Book
Paperback. Condition: New.
Published by Springer, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Seller: booksXpress, Bayonne, NJ, U.S.A.
Book
Soft Cover. Condition: new.
Published by Springer-Verlag New York Inc., 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Book Print on Demand
Paperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Published by Springer US Okt 2010, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Book Print on Demand
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics. 324 pp. Englisch.
Published by Springer US, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Seller: moluna, Greven, Germany
Book Print on Demand
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Delivers the information designers need to implement the right packaging approach for their specific application Explains tradeoffs to be made at each level of packaging to form the most reliable product at the lowest cost Focuses on how pa.
Published by Springer US, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Seller: AHA-BUCH GmbH, Einbeck, Germany
Book
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.Integrated Circuit Packaging, Assembly and Interconnections is an introduction, a review and an update of packaging technologies.
Published by Springer, 2010
ISBN 10: 1441939237ISBN 13: 9781441939234
Seller: Mispah books, Redhill, SURRE, United Kingdom
Book
Paperback. Condition: Like New. Like New. book.