"synopsis" may belong to another edition of this title.
Integrated Circuit Packaging, Assembly and Interconnections is intended as a multi-purpose text, serving individuals looking for an introduction, or a review, or an update of the various IC packaging, assembly, and interconnection technologies. To this end, it provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.
The focus is on the electronic manufacturing process which, in its simplest form, involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.
This material will provide a suitable knowledge-base essential for individuals who have the need or interest in understanding the basics of electronic manufacturing.
"About this title" may belong to another edition of this title.
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Book Description Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics. 324 pp. Englisch. Seller Inventory # 9781441939234
Book Description Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Delivers the information designers need to implement the right packaging approach for their specific application Explains tradeoffs to be made at each level of packaging to form the most reliable product at the lowest cost Focuses on how pa. Seller Inventory # 4174290
Book Description Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Reviewing the various IC packaging, assembly, and interconnection technologies, this professional guide and reference provides an overview of the materials and the processes, as well as the trends and available options, that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC.The focus is on the electronic manufacturing process, which in its simplest form involves assembly of the IC into a package or interconnect substrate or board. The book discusses the various packaging approaches available, namely, single chip, multichip, and Chip On Board; the assembly options, chip & wire, tape automated bonding, and flip chip; and the essential high density package/substrate manufacturing technologies, thin film, thick film, cofired ceramic, and laminate printed wiring board (PWB) processes. Included also is a discussion of high density PWBs using build up/sequential processes.Integrated Circuit Packaging, Assembly and Interconnections is an introduction, a review and an update of packaging technologies. Seller Inventory # 9781441939234