Materials for Electronic Packaging - Hardcover

Chung, Deborah D.L.

Hardcover

ISBN 10: 0750693142 ISBN 13: 9780750693141

Publisher: Butterworth-Heinemann, 1995

Synopsis

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

• Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors
• Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science
• Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems

About this title

From the Back Cover:

Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks, and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

About the Author:

Professor Deborah D.L. Chung, Composite Materials Research Laboratory, University at Buffalo, State University of New York

About this edition

• Publisher: Butterworth-Heinemann
• Publication date: 1995
• ISBN 10: 0750693142
• ISBN 13: 9780750693141
• Binding: Hardcover
• Number of pages: 368