Most design engineers are tasked to design against failure, and one of the biggest causes of product failure is failure of the material due to fatigue/fracture. From leading experts in fracture mechanics, this new text provides new approaches and new applications to advance the understanding of crack initiation and propagation. With applications in composite materials, layered structures, and microelectronic packaging, among others, this timely coverage is an important resource for anyone studying or applying concepts of fracture mechanics.
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Title: Fracture Mechanics <>Binding: Hardcover <>Author: Chin-Teh Sun <>Publisher: ACADEMIC PRESSAbout the Author:
Neil A. Armstrong Distinguished Professor of Aeronautics and Astronautics
Ph.D., Northwestern University 1967
Awards and Major Appointments
Research Award for excellence in faculty research, Schools of Engineering, Purdue University, 2004.
ASTM Committee D-30 Wayne W. Stinchcomb Memorial Award
Current research interests include the following areas:
Composite Materials and Structures
Smart Materials -
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