Microvias: For Low Cost, High Density Interconnects - Hardcover

Lau, John; Lee, Ricky

Hardcover

ISBN 10: 0071363270 ISBN 13: 9780071363273

Publisher: McGraw-Hill Education, 2001

Synopsis

A guide to microvias technology. It covers technology basics, design methods, heat concerns and developments, and surveys companies and products. Microvias products are essential to small mobile phones and other handheld electronic products, otherwise they would be twice their current size.

About this title

From the Back Cover:

The first comprehensive and in-depth guide to microvia and wafer level chip scale package (WLCSP) technologies. This reference gives you cutting edge information on the most important developments and latest research results in applying the microvia and WLCSP technologies to low-cost and high-density interconnects. For professionals active in microvia and WLCSP research and development, those who wish to master microvia and WLCSP problem solving methods, and those demanding a cost-effective design and high-yield manufacturing process for their low-cost and high-density interconnect systems, here is up-to-the-minute coverage of all aspects of this fascinating field.

This one-stop guide meets the reference needs of design, materials, process, equipment, manufacturing, reliability, component, packaging, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. With this book you will develop a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of microvia and WLCSP technologies. Among the topics explored:

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-IC trends and their packaging technology updates

-Design, materials, imaging, drilling, plating, etching, solder resist, machining, and routing of conventional PCB technologies

-Mechanical drilling for microvias

-Materials, mechanisms, tools, and processes for making microvias with Excimer, UC:YAG, and CO2 laser drilling

-Microvias formed by various photoimageable dielectrics and fine-line lithography

-Chemical- and plasma-etched microvias

-Conductive paste/ink-filled microvias

-Thin-film high-density interconnects for WLCSP applications

-Solders for the next generation of WLCSPs

-Creep of solders under combined loads

-Low-alpha-particle-bearing solders

-Lead-free solders

-Wafer bumping (by electroplating and stencil printing methods) with lead-free solders

-Assembly of flip chip on high-density PCBs or substrates with reworkable underfills and with no-flow underfills

-Solder-joint reliability of WLCSP on microvia build-up or substrates

Microvias: For Low-Cost and High-Density Interconnects is required reading for the electronic packaging industry. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. No matter how you use this book, you will see why it is the resource of choice for the field's leaders.

About the Author:

John H. Lau received his Ph.D. degree in Theoretical and Applied Mechanics from the University of Illinois (1977), a M.A.Sc. degree in Structural Engineering from the University of British Columbia (1973), a second M.S. degree in Engineering Physics from the University of Wisconsin (1974), and a third M.S. degree in Management Science from Fairleigh Dickinson University (1981). He also has a B.E. degree in Civil Engineering from National Taiwan University (1970). John is an interconnection technology scientist at Agilent Technologies, Inc. His current interests cover a broad range of electronic and optoelectronic packaging and manufacturing technology. Prior to Agilent, he worked for Express Packaging Systems, Hewlett-Packard Company, Sandia National Laboratory, Bechtel Power Corporation, and Exxon Production and Research Company. With more than 30 years of R&D and manufacturing experience in the electronics, petroleum, nuclear, and defense industries, he has given over 200 workshops, authored and co-authored over 180 peer reviewed technical publications, and is the author and editor of 13 books: Solder Joint Reliability; Handbook of Tape Automated Bonding; Thermal Stress and Strain in Microelectronics Packaging; The Mechanics of Solder Alloy Interconnects; Handbook of Fine Pitch Surface Mount Technology; Chip On Board Technologies for Multichip Modules; Ball Grid Array Technology; Flip Chip Technologies; Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies; Electronics Packaging: Design, Materials, Process, and Reliability; Chip Scale Package (CSP): Design, Materials, Process, Reliability, and Applications; Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, and Microvias for Low Cost, High Density Interconnects. John served as one of the associate editors of the IEEE Transactions on Components, Packaging, and Manufacturing Technology and ASME Transactions, Journal of Electronic Packaging. He also served as general chairman, program chairman, and session chairman, and invited speaker of several IEEE, ASME, ASM, MRS, IMAPS, SEMI, and SMI International conferences. He received a few awards from ASME and IEEE for best papers and outstanding technical achievements, and is an ASME Fellow and an IEEE Fellow. He is listed in American Men and Women of Science and Whos Who in America.

About this edition

• Publisher: McGraw-Hill Education
• Publication date: 2001
• ISBN 10: 0071363270
• ISBN 13: 9780071363273
• Binding: Hardcover
• Number of pages: 450