Electronic Packaging and Interconnection Handbook (Electronic Packaging and Interconnection Series) - Hardcover

Harper, Charles A.

9780070266940: Electronic Packaging and Interconnection Handbook (Electronic Packaging and Interconnection Series)

Hardcover

ISBN 10: 0070266948 ISBN 13: 9780070266940

Publisher: McGraw-Hill Inc.,US, 1996

This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas transforming the industry.

"synopsis" may belong to another edition of this title.

Review:

Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies. (Sci-Tech Book News 20041201)

From the Publisher:

The field's only comprehensive reference

MEMs packaging

Optoelectronic packaging

Ball grid array, flip chip, and direct chip attach

"About this title" may belong to another edition of this title.