Analysis, Architectures and Modelling of Embedded Systems: Third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, Langenargen, Germany, ... and Communication Technology, 310) - Softcover
Analysis, Architectures and Modelling of Embedded Systems This book constitutes the refereed proceedings of the third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, held in Langenargen, Germany, in September 2009. The 28 revised papers were selected from 46 submissions. The papers are organized in topical sections on modelling; transaction level modelling; scheduling and real-time systems; simulation, verification and test; platforms and processors; automotive systems; and wireless sensor networks. The volume also includes three case studies and two tutorials.
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This book constitutes the refereed proceedings of the third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, held in Langenargen, Germany, in September 2009.
The 28 revised papers were selected from 46 submissions. The papers are organized in topical sections on modelling; transaction level modelling; scheduling and real-time systems; simulation, verification and test; platforms and processors; automotive systems; and wireless sensor networks. The volume also includes three case studies and two tutorials.
"About this title" may belong to another edition of this title.
- PublisherSpringer
- Publication date2012
- ISBN 10 3642260195
- ISBN 13 9783642260193
- BindingPaperback
- Number of pages326
- EditorRettberg Achim, Zanella Mauro C., Amann Michael, Keckeisen Michael, Rammig Franz J.
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Book Description Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the technical program of the International Embedded Systems Symposium (IESS) 2009. Timely topics, techniques and trends in embedded system design are covered by the chapters in this volume, including modelling, simulation, verification, test, scheduling, platforms and processors. Particular emphasis is paid to automotive systems and wireless sensor networks. Sets of actual case studies in the area of embedded system design are also included. Over recent years, embedded systems have gained an enormous amount of proce- ing power and functionality and now enter numerous application areas, due to the fact that many of the formerly external components can now be integrated into a single System-on-Chip. This tendency has resulted in a dramatic reduction in the size and cost of embedded systems. As a unique technology, the design of embedded systems is an essential element of many innovations. Embedded systems meet their performance goals, including real-time constraints, through a combination of special-purpose hardware and software components tailored to the system requirements. Both the development of new features and the reuse of existing intellectual property components are essential to keeping up with ever more demanding customer requirements. Furthermore, design complexities are steadily growing with an increasing number of components that have to cooperate properly. Embedded system designers have to cope with multiple goals and constraints simul- neously, including timing, power, reliability, dependability, maintenance, packaging and, last but not least, price. 328 pp. Englisch. Seller Inventory # 9783642260193
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Book Description Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book presents the technical program of the International Embedded Systems Symposium (IESS) 2009. Timely topics, techniques and trends in embedded system design are covered by the chapters in this volume, including modelling, simulation, verification, t. Seller Inventory # 5054095
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Analysis, Architectures and Modelling of Embedded Systems : Third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, Langenargen, Germany, September 14-16, 2009, Proceedings
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Analysis, Architectures and Modelling of Embedded Systems : Third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, Langenargen, Germany, September 14-16, 2009, Proceedings
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Book Description Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the technical program of the International Embedded Systems Symposium (IESS) 2009. Timely topics, techniques and trends in embedded system design are covered by the chapters in this volume, including modelling, simulation, verification, test, scheduling, platforms and processors. Particular emphasis is paid to automotive systems and wireless sensor networks. Sets of actual case studies in the area of embedded system design are also included. Over recent years, embedded systems have gained an enormous amount of proce- ing power and functionality and now enter numerous application areas, due to the fact that many of the formerly external components can now be integrated into a single System-on-Chip. This tendency has resulted in a dramatic reduction in the size and cost of embedded systems. As a unique technology, the design of embedded systems is an essential element of many innovations. Embedded systems meet their performance goals, including real-time constraints, through a combination of special-purpose hardware and software components tailored to the system requirements. Both the development of new features and the reuse of existing intellectual property components are essential to keeping up with ever more demanding customer requirements. Furthermore, design complexities are steadily growing with an increasing number of components that have to cooperate properly. Embedded system designers have to cope with multiple goals and constraints simul- neously, including timing, power, reliability, dependability, maintenance, packaging and, last but not least, price. Seller Inventory # 9783642260193
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Book Description Condition: New. Editor(s): Rettberg, Achim; Zanella, Mauro C. (ZF Lemforder Fahrwerktechnik GmbH & Co.); Amann, Michael. Series: IFIP Advances in Information and Communication Technology. Num Pages: 326 pages, 165 black & white illustrations, biography. BIC Classification: UGC; UT; UYD. Category: (G) General (US: Trade). Dimension: 235 x 155 x 17. Weight in Grams: 504. . 2012. Paperback. . . . . Seller Inventory # V9783642260193
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