Fundamentals of Microsystems Packaging
Tummala, Rao
Sold by The Maryland Book Bank, Baltimore, MD, U.S.A.
AbeBooks Seller since 1 September 2010
Used - Hardcover
Condition: Used - Very good
Quantity: 1 available
Add to basketSold by The Maryland Book Bank, Baltimore, MD, U.S.A.
AbeBooks Seller since 1 September 2010
Condition: Used - Very good
Quantity: 1 available
Add to basket
*A comprehensive tutorial covering every major aspect of microelectronics, photonics, RF, packaging design, assembly, reliability, testing, manufacturing and its relevance to both semiconductors and systems.
*Rigorous coverage of electrical, mechanical, chemical, and materials aspects of each technology
*Easy-to-read schematics and block diagrams
*Fundamental approaches to all system issues
*Examples of all common configurations and technologies―wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others
*Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes
*Basics of electrical and reliability testing
*Hundreds of explanatory two-color illustrations
*Self-test problems and solutions in every chapter
*Glossary
*The best way to learn microsystems packaging through self-study or in a classroom―and the most comprehensive on-the-job reference
MICROSystems PACKAGINGFROM THE GROUND UP
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