Through Silicon Vias Integration by Lau John (19 results)

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Hardback. Condition: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.A comprehensive guide to TSV and other enabling technologies for 3D integrationWritten by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.Coverage includes:Nanotechnology and 3D integration for the semiconductor industryTSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealingTSVs: mechanical, thermal, and electrical behaviorsThin-wafer strength measurementWafer thinning and thin-wafer handlingMicrobumping, assembly, and reliabilityMicrobump electromigrationTransient liquid-phase bonding: C2C, C2W, and W2W2.5D IC integration with interposers3D IC integration with interposersThermal management of 3D IC integration3D IC packaging.

Gebunden. Condition: New. This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits-essential for the development of low-cost, high-performance electronic and optoelectronic products.&Uumlber den AutorrnrnnJohn H. Lau rece.

Hardback. Condition: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.A comprehensive guide to TSV and other enabling technologies for 3D integrationWritten by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.Coverage includes:Nanotechnology and 3D integration for the semiconductor industryTSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealingTSVs: mechanical, thermal, and electrical behaviorsThin-wafer strength measurementWafer thinning and thin-wafer handlingMicrobumping, assembly, and reliabilityMicrobump electromigrationTransient liquid-phase bonding: C2C, C2W, and W2W2.5D IC integration with interposers3D IC integration with interposersThermal management of 3D IC integration3D IC packaging.

Hardback. Condition: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.A comprehensive guide to TSV and other enabling technologies for 3D integrationWritten by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.Coverage includes:Nanotechnology and 3D integration for the semiconductor industryTSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealingTSVs: mechanical, thermal, and electrical behaviorsThin-wafer strength measurementWafer thinning and thin-wafer handlingMicrobumping, assembly, and reliabilityMicrobump electromigrationTransient liquid-phase bonding: C2C, C2W, and W2W2.5D IC integration with interposers3D IC integration with interposersThermal management of 3D IC integration3D IC packaging.

Buch. Condition: Neu. Neuware - Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.

Hardback. Condition: New. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.A comprehensive guide to TSV and other enabling technologies for 3D integrationWritten by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.Coverage includes:Nanotechnology and 3D integration for the semiconductor industryTSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealingTSVs: mechanical, thermal, and electrical behaviorsThin-wafer strength measurementWafer thinning and thin-wafer handlingMicrobumping, assembly, and reliabilityMicrobump electromigrationTransient liquid-phase bonding: C2C, C2W, and W2W2.5D IC integration with interposers3D IC integration with interposersThermal management of 3D IC integration3D IC packaging.

paperback. Condition: New. Paperback. Pub Date :2014-01-01 Pages: 487 Language: Chinese Publisher: Science Press Information Science and Technology Academic Works Series: silicon vias for 3D integration technology to discuss the three-dimensional integrated silicon systems used in electronics. optoelectronics and MEMS devices latest progress through hole (TSV) technology and the possible future evolution trend. while a three-dimensional integrated detailed discussion of the major technological problems that exist in ke.