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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Volume 2.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
£ 17.90
Convert currency£ 10.43 shipping from Germany to United KingdomQuantity: 1 available
Add to basketXXX, 735 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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MECHANICAL BEHAVIOR OF MATERIALS AND STRUCTURES IN MICROELECTRONICS
Published by Cambridge University Press, 1991
ISBN 10: 1558991204 ISBN 13: 9781558991200
Language: English
£ 32.63
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Add to basketCondition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Structural Analysis in Microelectronic and Fiber-Optic Systems: Volume I Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis
Published by Van Nostrand Reinhold, 1991
ISBN 10: 0442207719 ISBN 13: 9780442207717
Language: English
£ 29.60
Convert currency£ 12.27 shipping from U.S.A. to United KingdomQuantity: 1 available
Add to basketHardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 1.81.
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Paperback. Condition: New.
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Human-in-the-loop : Probabilistic Modeling of an Aerospace Mission Outcome
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Avoiding Inelastic Strains in Solder Joint Interconnections of Ic Devices
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 61.13
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Reliability of Photonics Materials and Structures: Symposium Held April 13-16, 1998, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings)
Published by Materials Research Society, 1998
ISBN 10: 1558994378 ISBN 13: 9781558994379
Language: English
Hardcover. Condition: Like New. Like New. book.
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£ 22.22
Convert currency£ 85.64 shipping from U.S.A. to United KingdomQuantity: 1 available
Add to basketHardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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£ 95.58
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Add to basketHardcover. Condition: As New. No Jacket. Pages are clean and are not marred by notes or folds of any kind. ~ ThriftBooks: Read More, Spend Less 2.5.
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Published by CRC Press 2020-11-26, 2020
ISBN 10: 113862473X ISBN 13: 9781138624733
Language: English
Hardcover. Condition: New.
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£ 127.32
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Add to basketCondition: New. pp. 336.
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging : Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging
Published by Springer US, Springer New York, 2016
ISBN 10: 1489978852 ISBN 13: 9781489978851
Language: English
£ 493.55
Convert currency£ 12.15 shipping from Germany to United KingdomQuantity: 1 available
Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions.Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.
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Micro And Opto Electronic Materials And Structures: Physics, Mechanics, Design, Reliability, Packaging, 2 Volumes Set
Published by Springer, 2007
Language: English
£ 518.59
Convert currency£ 11.29 shipping from India to United KingdomQuantity: 1 available
Add to basketHardcover. Condition: New. ISBN:9780387279749.
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Advances in Electronic Packaging
Published by Amer Society of Mechanical 0, 1997
ISBN 10: 0791815595 ISBN 13: 9780791815595
Language: English
Hardcover. Condition: Like New. Like New. book.
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Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials Mechan
Published by Springer, 2006
Hardcover. Condition: Like New. Like New. book.
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£ 99.96
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Add to basketCondition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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£ 99.96
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Add to basketCondition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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£ 200.42
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Add to basketGebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presented in a systematic manner based on lectures and tutorials by the authorsFocused on improved reliability in plastic packagingProvides theory and new industry applicationsMoisture Sensitivity of Plastic Packages of IC Devices provides information o.
