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Soudris Dimitrios (356 results)
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Paperback. Condition: Used: Good. xlibrary paperback 2000 withdrawn stamp in book/ on edge of pages clean text 338 pages::: L-2.
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Designing CMOS Circuits for Low Power (European Low-Power Initiative for Electronic System Design (Series).)
Seller: Midtown Scholar Bookstore, Harrisburg, PA, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Very Good. crisp clean w/light shelfwear/edgewear - may have remainder mark Standard-sized.
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International EditionCondition: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide.
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Condition: New. Brand New, Softcover edition. This item may ship from the US or our Overseas warehouse depending on your location and stock availability.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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£ 24.22
Convert currency£ 7.55 shipping from United Kingdom to U.S.A.Quantity: 1 available
Add to basketCondition: Like New. Most items will be dispatched the same or the next working day. An apparently unread copy in perfect condition. Dust cover is intact with no nicks or tears. Spine has no signs of creasing. Pages are clean and not marred by notes or folds of any kind.
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Soft cover. Condition: New. ISBN:9788184897647,Territorial restriction maybe printed on the book. This is an Int'l edition, ISBN and cover may differ from US edition, Contents same as US edition.
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£ 36.74
Convert currencyFree shipping from Australia to U.S.A.Quantity: Over 20 available
Add to basketBrand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address.
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Fine- and Coarse-Grain Reconfigurable Computing.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
£ 11.69
Convert currency£ 26.19 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketXVI, 381 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Sprache: Englisch.
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![Stock image for Designing 2D and 3D Network-on-Chip Architectures [Elektronische Ressource]. for sale by Universitätsbuchhandlung Herta Hold GmbH](https://pictures.abebooks.com/isbn/9781461442745-uk-300.jpg)
Designing 2D and 3D Network-on-Chip Architectures [Elektronische Ressource].
Published by New York, NY, Imprint: Springer., 2014
ISBN 10: 1461442745 ISBN 13: 9781461442745
Language: English
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
£ 12.59
Convert currency£ 26.19 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketXI, 265 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped.
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Trusted Computing for Embedded Systems.
Published by Cham, Springer International Publishing., 2015
ISBN 10: 331909419X ISBN 13: 9783319094199
Language: English
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
£ 13.49
Convert currency£ 26.19 shipping from Germany to U.S.A.Quantity: 3 available
Add to basketAufl. 2014. XXVI, 299 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Sprache: Englisch.
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Hardware Accelerators in Data Centers.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
£ 14.39
Convert currency£ 26.19 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketix, 279 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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IoT for Smart Grids. Design Challenges and Paradigms.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
£ 16.19
Convert currency£ 26.19 shipping from Germany to U.S.A.Quantity: 1 available
Add to basketxv, 282 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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hardcover. Condition: As New. Ships Out Tomorrow!
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Harnessing Performance Variability in Embedded and High-performance Many/Multi-core Platforms. A Cross-layer Approach.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
£ 17.98
Convert currency£ 26.19 shipping from Germany to U.S.A.Quantity: 3 available
Add to basketX, 325 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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£ 39.44
Convert currency£ 6.50 shipping from United Kingdom to U.S.A.Quantity: 3 available
Add to basketCondition: New.
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Condition: New.
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Condition: New.
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VLSI-SoC: Design Methodologies for SoC and SiP (Hardcover)
Published by Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, Berlin, 2010
ISBN 10: 3642122663 ISBN 13: 9783642122668
Language: English
Hardcover. Condition: new. Hardcover. This book contains extended and revised versions of the best papers that were p- sented during the 16th edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. The 16th conference was held at the Grand Hotel of Rhodes Island, Greece (October 1315, 2008). Previous conferences have taken place in Edinburgh, Trondheim, V- couver, Munich, Grenoble, Tokyo, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice and Atlanta. VLSI-SoC 2008 was the 16th in a series of international conferences sponsored by IFIP TC 10 Working Group 10.5 and IEEE CEDA that explores the state of the art and the new developments in the field of VLSI systems and their designs. The purpose of the conference was to provide a forum to exchange ideas and to present industrial and research results in the fields of VLSI/ULSI systems, embedded systems and - croelectronic design and test. This book contains extended and revised versions of the best papers that were p- sented during the 16th edition of the IFIP/IEEE WG10.5 International Conference on Very Large Scale Integration, a global System-on-a-Chip Design & CAD conference. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Three Dimensional System Integration (Hardcover)
Published by Springer-Verlag New York Inc., New York, NY, 2010
ISBN 10: 1441909613 ISBN 13: 9781441909619
Language: English
Hardcover. Condition: new. Hardcover. Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain. Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Condition: New.
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Condition: New.
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Condition: New.
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Condition: New.
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Condition: New. SUPER FAST SHIPPING.
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Condition: New. SUPER FAST SHIPPING.
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Condition: New. SUPER FAST SHIPPING.
