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Condition: Like New. Most items will be dispatched the same or the next working day. An apparently unread copy in perfect condition. Dust cover is intact with no nicks or tears. Spine has no signs of creasing. Pages are clean and not marred by notes or folds of any kind.
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Dynamic Memory Management for Embedded Systems
Published by Springer International Publishing, 2014
ISBN 10: 331910571X ISBN 13: 9783319105710
Language: English
£ 15.02
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Add to basketCondition: Sehr gut. Zustand: Sehr gut | Seiten: 260 | Sprache: Englisch | Produktart: Sonstiges.
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![Stock image for Designing 2D and 3D Network-on-Chip Architectures [Elektronische Ressource]. for sale by Universitätsbuchhandlung Herta Hold GmbH](https://pictures.abebooks.com/isbn/9781461442745-uk-300.jpg)
Designing 2D and 3D Network-on-Chip Architectures [Elektronische Ressource].
Published by New York, NY, Imprint: Springer., 2014
ISBN 10: 1461442745 ISBN 13: 9781461442745
Language: English
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
£ 12.52
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Add to basketXI, 265 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped.
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Trusted Computing for Embedded Systems.
Published by Cham, Springer International Publishing., 2015
ISBN 10: 331909419X ISBN 13: 9783319094199
Language: English
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
£ 13.41
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Add to basketAufl. 2014. XXVI, 299 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stamped. Sprache: Englisch.
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Hardware Accelerators in Data Centers.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
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£ 14.31
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Add to basketix, 279 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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International Edition£ 25.54
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Add to basketCondition: New. Brand New. Soft Cover International Edition. Different ISBN and Cover Image. Priced lower than the standard editions which is usually intended to make them more affordable for students abroad. The core content of the book is generally the same as the standard edition. The country selling restrictions may be printed on the book but is no problem for the self-use. This Item maybe shipped from US or any other country as we have multiple locations worldwide.
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IoT for Smart Grids. Design Challenges and Paradigms.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
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£ 16.10
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Add to basketxv, 282 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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£ 16.75
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Add to basketSoft cover. Condition: New. ISBN:9788184897647,Territorial restriction maybe printed on the book. This is an Int'l edition, ISBN and cover may differ from US edition, Contents same as US edition.
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Harnessing Performance Variability in Embedded and High-performance Many/Multi-core Platforms. A Cross-layer Approach.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
£ 17.88
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Add to basketX, 325 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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£ 11.52
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Add to basketPaperback. Condition: Used: Good. xlibrary paperback 2000 withdrawn stamp in book/ on edge of pages clean text 338 pages::: L-2.
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VLSI-SoC: Design Methodologies for SoC and SiP : 16th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2008, Rhodes Island, Greece, October 13-15, 2008, Revised Selected Papers
Published by Springer Berlin Heidelberg, 2014
ISBN 10: 3642422411 ISBN 13: 9783642422416
Language: English
£ 35.58
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Add to basketCondition: Sehr gut. Zustand: Sehr gut | Seiten: 304 | Sprache: Englisch | Produktart: Bücher.
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Dynamic Memory Management for Embedded Systems
Published by Springer International Publishing, 2016
ISBN 10: 3319362208 ISBN 13: 9783319362205
Language: English
£ 35.58
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Add to basketCondition: Sehr gut. Zustand: Sehr gut | Seiten: 260 | Sprache: Englisch | Produktart: Bücher.
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VLSI-SoC: Design Methodologies for SoC and SiP : 16th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2008, Rhodes Island, Greece, October 13-15, 2008, Revised Selected Papers
Published by Springer Berlin Heidelberg, 2010
ISBN 10: 3642122663 ISBN 13: 9783642122668
Language: English
£ 37.27
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Add to basketCondition: Sehr gut. Zustand: Sehr gut | Seiten: 304 | Sprache: Englisch | Produktart: Bücher.
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£ 38.50
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Add to basketCondition: Sehr gut. Zustand: Sehr gut | Seiten: 246 | Sprache: Englisch | Produktart: Bücher.
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Paperback. Condition: Brand New. 290 pages. 9.18x6.12x9.21 inches. In Stock.
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£ 44.15
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Add to basketCondition: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
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Applied Reconfigurable Computing : 11th International Symposium, Arc 2015
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 50.81
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Three Dimensional System Integration : IC Stacking Process and Design
Published by Springer US, Springer New York, 2014
ISBN 10: 1489981829 ISBN 13: 9781489981820
Language: English
£ 50.94
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Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place.This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
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Designing 2D and 3D Network-on-Chip Architectures
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 87.22
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Cyber-Physical Systems : Decision Making Mechanisms and Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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Designing 2D and 3D Network-on-Chip Architectures
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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£ 97.62
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Fine- and Coarse-Grain Reconfigurable Computing
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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Harnessing Performance Variability in Embedded and High-performance Many/Multi-core Platforms: A Cross-layer Approach
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 97.62
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Scalable Multi-Core Architectures : Design Methodologies and Tools
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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£ 102.02
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Trusted Computing for Embedded Systems
Published by Springer International Publishing, 2016
ISBN 10: 3319362798 ISBN 13: 9783319362793
Language: English
£ 95.67
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Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes the state-of-the-art in trusted computing for embedded systems. It shows how a variety of security and trusted computing problems are addressed currently and what solutions are expected to emerge in the coming years. The discussion focuses on attacks aimed at hardware and software for embedded systems, and the authors describe specific solutions to create security features. Case studies are used to present new techniques designed as industrial security solutions. Coverage includes development of tamper resistant hardware and firmware mechanisms for lightweight embedded devices, as well as those serving as security anchors for embedded platforms required by applications such as smart power grids, smart networked and home appliances, environmental and infrastructure sensor networks, etc. Enables readers to address a variety of security threats to embedded hardware and software; Describes design of secure wireless sensor networks, to address secure authentication of trusted portable devices for embedded systems; Presents secure solutions for the design of smart-grid applications and their deployment in large-scale networked and systems.
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Scalable Multi-core Architectures : Design Methodologies and Tools
Published by Springer New York, Springer New York, 2014
ISBN 10: 1489993150 ISBN 13: 9781489993151
Language: English
£ 109.82
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Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - As Moore's law continues to unfold, two important trends have recently emerged. First, the growth of chip capacity is translated into a corresponding increase of number of cores. Second, the parallelization of the computation and 3D integration technologies lead to distributed memory architectures.This book describes recent research that addresses urgent challenges in many-core architectures and application mapping. It addresses the architectural design of many core chips, memory and data management, power management, design and programming methodologies. It also describes how new techniques have been applied in various industrial case studies.
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Hardware Accelerators in Data Centers
Published by Springer International Publishing, Springer International Publishing, 2018
ISBN 10: 3030065189 ISBN 13: 9783030065188
Language: English
£ 133.94
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Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides readers with an overview of the architectures, programming frameworks, and hardware accelerators for typical cloud computing applications in data centers. The authors present the most recent and promising solutions, using hardware accelerators to provide high throughput, reduced latency and higher energy efficiency compared to current servers based on commodity processors. Readers will benefit from state-of-the-art information regarding application requirements in contemporary data centers, computational complexity of typical tasks in cloud computing, and a programming framework for the efficient utilization of the hardware accelerators.
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Hardcover. Condition: Brand New. 193 pages. 9.25x6.10x9.28 inches. In Stock.
