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Sachdev Manoj Gyvez Jose Pineda (16 results)
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hardcover. Condition: As New. 2nd. Ships Out Tomorrow!
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Condition: very_good. This books is in Very good condition. There may be a few flaws like shelf wear and some light wear.
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Defect-Oriented Testing for Nano-Metric CMOS VLSI Circuits (Frontiers in Electronic Testing, 34)
Book 18 of 40: Frontiers in Electronic TestingSeller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In.
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Condition: New. pp. 352 2nd Edition.
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Condition: New. pp. 352 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
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Defect-Oriented Testing for Nano-Metric CMOS VLSI Circuits (Frontiers in Electronic Testing, 34)
Book 18 of 40: Frontiers in Electronic TestingSeller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In.
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Hardcover. Condition: Like New. Like New. book.
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Condition: Sehr gut. Zustand: Sehr gut | Seiten: 352 | Sprache: Englisch | Produktart: Bücher | Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent.
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Paperback. Condition: Brand New. 2nd edition. 349 pages. 9.10x6.10x0.90 inches. In Stock.
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Hardcover. Condition: Brand New. 2nd edition. 328 pages. 9.25x6.25x0.75 inches. In Stock.
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Paperback. Condition: Like New. Like New. book.
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Wide coverage of topics in test engineeringUnique defect-oriented focus of the materialsIntroduction to yield engineering common practicesThe 2nd edition of defect oriented testing has been extensively updated. New cha.
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Wide coverage of topics in test engineeringUnique defect-oriented focus of the materialsIntroduction to yield engineering common practicesThe 2nd edition of defect oriented testing has been extensively updated. New cha.
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Condition: New. PRINT ON DEMAND pp. 352.
