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R R Tummala (112 results)
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Microelectronic Packaging Handbook
Published by Wiley & Sons, Incorporated, John, 1989
ISBN 10: 0442205783 ISBN 13: 9780442205782
Language: English
First Edition
£ 9.35
Convert currency£ 10.45 shipping from U.S.A. to United KingdomQuantity: 1 available
Add to basketCondition: Good. 1st Edition. Used book that is in clean, average condition without any missing pages.
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Condition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings With owner's name inside cover. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1100grams, ISBN:9780412084515.
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Condition: Good. Volume 2. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1650grams, ISBN:9780412084416.
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Sources and Expressions of Resiliency in Trauma Survivors : Ecological Theory, Multicultural Practice
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Condition: New. pp. 1000.
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£ 8.01
Convert currency£ 85.64 shipping from U.S.A. to United KingdomQuantity: 1 available
Add to basketpaperback. Condition: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority!
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£ 90.27
Convert currency£ 14.89 shipping from U.S.A. to United KingdomQuantity: 3 available
Add to basketCondition: good. May show signs of wear, highlighting, writing, and previous use. This item may be a former library book with typical markings. No guarantee on products that contain supplements Your satisfaction is 100% guaranteed. Twenty-five year bookseller with shipments to over fifty million happy customers.
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£ 79.14
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Add to basketHardcover. Condition: New. In shrink wrap. Looks like an interesting title!
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£ 38.30
Convert currency£ 85.64 shipping from U.S.A. to United KingdomQuantity: 1 available
Add to baskethardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
Published by Springer-Verlag Publishing, 1997
ISBN 10: 0412084414 ISBN 13: 9780412084416
Language: English
£ 95.85
Convert currency£ 37.20 shipping from U.S.A. to United KingdomQuantity: 1 available
Add to basketCondition: Good. 2. Good+; Hardcover; Former corporate library copy with company stamp to the right textblock edge, inside each cover, and to the first and last endpapers; Covers are clean and glossy; Text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Purple and orange covers with title in white and yellow lettering; 2nd Edition; 1997, Springer-Verlag Publishing; 1030 pages; "Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging," by R.R. Tummala, et al.
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Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 139.22
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Add to basketCondition: New. In.
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Electronic Packaging for High Reliability, Low Cost Electronics
Published by Springer Netherlands, 2010
ISBN 10: 904815085X ISBN 13: 9789048150854
Language: English
£ 147.19
Convert currency£ 12.15 shipping from Germany to United KingdomQuantity: 1 available
Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
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Microelectronics Packaging Handbook: Technology Drivers Part I
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 191.22
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Add to basketCondition: New. In.
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Fundamentals of Device and Systems Packaging : Technologies and Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 211.48
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Add to basketCondition: New.
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Paperback. Condition: Like New. Like New. book.
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Fundamentals of microsystems packaging(Chinese Edition)
Published by Southeast University Press, 1991
ISBN 10: 7810894196 ISBN 13: 9787810894197
£ 118.66
Convert currency£ 11.17 shipping from China to United KingdomQuantity: 1 available
Add to basketpaperback. Condition: New. Language:Chinese.Paperback. Publisher: Southeast University Press. The book include: microelectronics. photonics. RF. MEMS base.
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Device and system packaging technology and application original book 2nd edition(Chinese Edition)
Published by Machinery Industry Press, 2021
ISBN 10: 7111675665 ISBN 13: 9787111675662
Language: Chinese
£ 207.30
Convert currency£ 11.17 shipping from China to United KingdomQuantity: 3 available
Add to basketpaperback. Condition: New. Language:Chinese.Paperback. Pub Date: 2021-06-01 Publisher: Machinery Industry Press The whole book is divided into two parts. the basic principles of packaging and the application of technology. with 22 chapters in total.?Discuss thermal-mechanical reliability. micro- and nano-level packaging. ceramic. organic materials. glass and silicon packaging substrates. radio frequency and millimeter wave packaging. MEMS and sensor packaging. PCB packaging and board-level assembly; packaging technolog.
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£ 254.90
Convert currency£ 11.29 shipping from India to United KingdomQuantity: 1 available
Add to basketN.A. Condition: New. ISBN:9780412085611.
