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Elfadel Ibrahim (176 results)
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Condition: Very Good. Most items will be dispatched the same or the next working day. A copy that has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.
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VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things. 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers.
Book 212 of 292: IFIP Advances in Information and Communication TechnologySeller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
XIV, 255 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. IFIP Advances in Information and Communication Technology, Vol. 500. Sprache: Englisch.
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The IoT Physical Layer. Design and Implementation.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
382 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Analog Circuits and Signal Processing Sprache: Englisch.
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3D Stacked Chips. From Emerging Processes to Heterogeneous Systems.
Language: English
Published by Cham, Springer International Publishing., 2015
ISBN 10: 3319204807 ISBN 13: 9783319204802
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 5 out of 5 stars
Aufl. 2016. 235 mm x 155 mm, 0 g. XXIII, 339 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
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Condition: Very Good. Most items will be dispatched the same or the next working day. A copy that has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.
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Condition: New.
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Paperback or Softback. Condition: New. MEMS Accelerometers. Book.
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Condition: New.
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Condition: New.
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Vlsi-soc - Opportunities and Challenges Beyond the Internet of Things : 25th Ifip Wg 10.5/Ieee International Conference on Very Large Scale Integration, Vlsi-soc 2017, Abu Dhabi, United Arab Emirates, October 23?25, 2017, Revised and Extended Selected Papers
Book 212 of 292: IFIP Advances in Information and Communication TechnologyCondition: New.
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VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things (Paperback)
Book 212 of 292: IFIP Advances in Information and Communication TechnologyLanguage: English
Published by Springer Nature Switzerland AG, Cham, 2020
ISBN 10: 3030156656 ISBN 13: 9783030156657
Paperback. Condition: new. Paperback. This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present. This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Condition: As New. Unread book in perfect condition.
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Condition: As New. Unread book in perfect condition.
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Vlsi-soc - Opportunities and Challenges Beyond the Internet of Things : 25th Ifip Wg 10.5/Ieee International Conference on Very Large Scale Integration, Vlsi-soc 2017, Abu Dhabi, United Arab Emirates, October 23?25, 2017, Revised and Extended Selected Papers
Book 212 of 292: IFIP Advances in Information and Communication TechnologyCondition: As New. Unread book in perfect condition.
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MEMS Accelerometers
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 46.46
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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MEMS Accelerometers
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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MEMS Accelerometers
Seller: Rarewaves.com USA, London, LONDO, United Kingdom
Seller rating 5 out of 5 stars
Paperback. Condition: New.
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3D Stacked Chips (Paperback)
Language: English
Published by Springer International Publishing AG, Cham, 2018
ISBN 10: 3319793055 ISBN 13: 9783319793054
Paperback. Condition: new. Paperback. This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 49.30
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 49.62
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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3D Stacked Chips
Language: English
Published by Springer International Publishing AG, CH, 2016
ISBN 10: 3319204807 ISBN 13: 9783319204802
Seller: Rarewaves.com USA, London, LONDO, United Kingdom
Seller rating 5 out of 5 stars
Hardback. Condition: New. 1st ed. 2016.
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VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things (IFIP Advances in Information and Communication Technology)
Book 212 of 292: IFIP Advances in Information and Communication TechnologySeller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 54.30
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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3d Stacked Chips : From Emerging Processes to Heterogeneous Systems
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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MEMS Accelerometers
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
