Order Total (1 Item Items):
Shipping Destination:
Belavic Darko (23 results)
Skip to main search results
Search filters
Product Type
- All Product Types
- Books (23)
- Magazines & Periodicals (No further results match this refinement)
- Comics (No further results match this refinement)
- Sheet Music (No further results match this refinement)
- Art, Prints & Posters (No further results match this refinement)
- Photographs (No further results match this refinement)
- Maps (No further results match this refinement)
- Manuscripts & Paper Collectibles (No further results match this refinement)
Condition Learn more
- New (18)
- As New, Fine or Near Fine (4)
- Very Good or Good (1)
- Fair or Poor (No further results match this refinement)
- As Described (No further results match this refinement)
Binding
Collectible Attributes
- First Edition (No further results match this refinement)
- Signed (No further results match this refinement)
- Dust Jacket (No further results match this refinement)
- Seller-Supplied Images (14)
- Not Print on Demand (15)
Language (1)
Price
- Any Price
- Under £ 20 (No further results match this refinement)
- £ 20 to £ 35 (No further results match this refinement)
- Over £ 35
Free Shipping
Seller Location
Seller Rating
-
hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
-
Electronic Packaging for High Reliability, Low Cost Electronics (NATO Science Partnership Subseries: 3, 57)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 134.30
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
-
Condition: New.
-
-
Electronic Packaging for High Reliability : Low Cost Electronics
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 134.29
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
-
Electronic Packaging for High Reliability, Low Cost Electronics
Language: English
Published by Kluwer Academic Publishers, 2000
ISBN 10: 0792352181 ISBN 13: 9780792352181
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Editor(s): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko. Series: NATO Science Partnership Subseries: 3. Num Pages: 306 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 1360. . 2000. Hardback. . . . .
-
Taschenbuch. Condition: Neu. Electronic Packaging for High Reliability, Low Cost Electronics | R. R. Tummala (u. a.) | Taschenbuch | x | Englisch | 2010 | Springer | EAN 9789048150854 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
-
Electronic Packaging for High Reliability, Low Cost Electronics
Language: English
Published by Springer Netherlands, Springer Netherlands, 2010
ISBN 10: 904815085X ISBN 13: 9789048150854
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
-
Electronic Packaging for High Reliability, Low Cost Electronics
Language: English
Published by Springer Netherlands, Springer Netherlands, 2000
ISBN 10: 0792352181 ISBN 13: 9780792352181
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.
-
Electronic Packaging for High Reliability : Low Cost Electronics
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 204.99
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
-
Hardcover. Condition: Like New. Like New. book.
-
Electronic Packaging for High Reliability, Low Cost Electronics
Language: English
Published by Kluwer Academic Publishers, 2000
ISBN 10: 0792352181 ISBN 13: 9780792352181
Condition: New. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Editor(s): Tummala, R. R.; Kosec, Marija; Jones, W.K.; Belavic, Darko. Series: NATO Science Partnership Subseries: 3. Num Pages: 306 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 19. Weight in Grams: 1360. . 2000. Hardback. . . . . Books ship from the US and Ireland.
-
Condition: As New. Unread book in perfect condition.
-
Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
-
Paperback. Condition: Brand New. 296 pages. 9.25x6.10x0.70 inches. In Stock.
-
Condition: new. Questo è un articolo print on demand.
-
Electronic Packaging for High Reliability, Low Cost Electronics
Language: English
Published by Springer Netherlands Dez 2010, 2010
ISBN 10: 904815085X ISBN 13: 9789048150854
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. 308 pp. Englisch.
-
Electronic Packaging for High Reliability, Low Cost Electronics
Language: English
Published by Springer Netherlands, 2000
ISBN 10: 0792352181 ISBN 13: 9780792352181
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within.
-
Electronic Packaging for High Reliability, Low Cost Electronics
Language: English
Published by Springer Netherlands, 2010
ISBN 10: 904815085X ISBN 13: 9789048150854
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of the NATO Advanced Research Workshop, Bled, Slovenia, May 10-13, 1997 Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within.
-
Buch. Condition: Neu. Electronic Packaging for High Reliability, Low Cost Electronics | R. R. Tummala (u. a.) | Buch | x | Englisch | 2000 | Springer Netherland | EAN 9780792352181 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
-
Electronic Packaging for High Reliability, Low Cost Electronics
Language: English
Published by Springer Netherlands, Springer Netherlands Dez 2010, 2010
ISBN 10: 904815085X ISBN 13: 9789048150854
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 308 pp. Englisch.
-
Electronic Packaging for High Reliability, Low Cost Electronics
Language: English
Published by Springer Netherlands, Springer Netherlands Feb 2000, 2000
ISBN 10: 0792352181 ISBN 13: 9780792352181
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 312 pp. Englisch.
-
Electronic Packaging for High Reliability, Low Cost Electronics
Language: English
Published by Springer Netherlands Feb 2000, 2000
ISBN 10: 0792352181 ISBN 13: 9780792352181
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies. 312 pp. Englisch.
