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Published by Materials Research Society, 2001
ISBN 10: 1558995307ISBN 13: 9781558995307
Seller: Zubal-Books, Since 1961, Cleveland, OH, U.S.A.
Book
Condition: Very Good. 522 pp., Hardcover, previous owner's handstamp to front pastedown, else very good. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
Soft cover. Condition: Near Fine. First issue of Kayak. Light soiling along fore-edge of front cover and fore-edge of one page. Bottom corner mildly bumped, else fine. Interior is clean and unmarked. 60 pages. Includes work by Robert Bly, Gene Frumkin, George Hitchcock, X. J. Kennedy, Thomas McGrath, David Antin, Robert Peterson, Saul Touster, Louis Simpson, Louis Z. Hammer, Alvaro Cardona-Hine, H. R. Hays, John Haines, Eli Shul, James Spencer, John Ridland, Martin Lieberman, and David Palmer.
Published by Materials Research Society, 1996
ISBN 10: 155899324XISBN 13: 9781558993242
Seller: Book Broker, Berlin, Germany
Book
Condition: Sehr gut. 450 Seiten Alle Bücher & Medienartikel von Book Broker sind stets in gutem & sehr gutem gebrauchsfähigen Zustand. Dieser Artikel weist folgende Merkmale auf: Helle/saubere Seiten in fester Bindung. Mit Namenseintrag. So gut wie neu. Sprache: Englisch Gewicht in Gramm: 748 Gebundene Ausgabe, Größe: 0 x 0 x 0 cm.
Published by Cambridge University Press, 1998
ISBN 10: 1558993886ISBN 13: 9781558993884
Seller: dsmbooks, Liverpool, United Kingdom
Book
Hardcover. Condition: Like New. Like New. book.
Published by Springer-Verlag Publishing, 2000
ISBN 10: 3540667725ISBN 13: 9783540667728
Seller: Salish Sea Books, Bellingham, WA, U.S.A.
Book
Condition: Good. Good+; Hardcover; Withdrawn library copy with the standard library markings; Light wear to the covers; Library stamps to the endpapers; Text pages are clean & unmarked; Binding is excellent with a straight spine; This book will be stored and delivered in a sturdy cardboard box with foam padding; Medium Format (8.5" - 9.75" tall); Light tan covers with title in white lettering; 2000, Springer-Verlag Publishing; 655 pages; "Handbook of Advanced Plasma Processing Techniques," by R.J. Shul & S.J. Pearton.
Published by Springer, 2000
ISBN 10: 3540667725ISBN 13: 9783540667728
Seller: BennettBooksLtd, North Las Vegas, NV, U.S.A.
Book
Condition: New. New. In shrink wrap. Looks like an interesting title! 2.73.
Published by Springer Berlin, 2000
ISBN 10: 3540667725ISBN 13: 9783540667728
Seller: Buchpark, Trebbin, Germany
Book
Condition: Sehr gut. 2000. Gepflegter, sauberer Zustand. 366270/2.
Published by Springer, 2012
ISBN 10: 3642630960ISBN 13: 9783642630965
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Book Print on Demand
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Published by Springer, 2000
ISBN 10: 3540667725ISBN 13: 9783540667728
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Book Print on Demand
Condition: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
Published by Springer, 2012
ISBN 10: 3642630960ISBN 13: 9783642630965
Seller: booksXpress, Bayonne, NJ, U.S.A.
Book
Soft Cover. Condition: new.
Published by Springer, 2000
ISBN 10: 3540667725ISBN 13: 9783540667728
Seller: booksXpress, Bayonne, NJ, U.S.A.
Book
Hardcover. Condition: new.
Published by Springer Berlin Heidelberg, 2000
ISBN 10: 3540667725ISBN 13: 9783540667728
Seller: moluna, Greven, Germany
Book
Condition: New.
Published by Springer Berlin Heidelberg, 2012
ISBN 10: 3642630960ISBN 13: 9783642630965
Seller: moluna, Greven, Germany
Book
Kartoniert / Broschiert. Condition: New.
Published by Springer, 2012
ISBN 10: 3642630960ISBN 13: 9783642630965
Seller: Lucky's Textbooks, Dallas, TX, U.S.A.
Book
Condition: New.
Published by Springer, 2000
ISBN 10: 3540667725ISBN 13: 9783540667728
Seller: Lucky's Textbooks, Dallas, TX, U.S.A.
Book
Condition: New.
Published by CAMBRIDGE, 2014
ISBN 10: 1107413419ISBN 13: 9781107413412
Seller: Iridium_Books, DH, SE, Spain
Book
Condition: Muy Bueno / Very Good.
Published by Springer Berlin Heidelberg Nov 2012, 2012
ISBN 10: 3642630960ISBN 13: 9783642630965
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Book Print on Demand
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed 'trial-and-error' approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved. 672 pp. Englisch.
Published by Springer Berlin Heidelberg Aug 2000, 2000
ISBN 10: 3540667725ISBN 13: 9783540667728
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Book Print on Demand
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed 'trial-and-error' approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved. 672 pp. Englisch.
Published by Springer Berlin Heidelberg, 2012
ISBN 10: 3642630960ISBN 13: 9783642630965
Seller: AHA-BUCH GmbH, Einbeck, Germany
Book
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed 'trial-and-error' approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Published by Springer Berlin Heidelberg, 2000
ISBN 10: 3540667725ISBN 13: 9783540667728
Seller: AHA-BUCH GmbH, Einbeck, Germany
Book
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed 'trial-and-error' approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Published by Springer, 2012
ISBN 10: 3642630960ISBN 13: 9783642630965
Seller: Books Puddle, New York, NY, U.S.A.
Book
Condition: New. pp. 672.
Published by Springer Verlag, 2012
ISBN 10: 3642630960ISBN 13: 9783642630965
Seller: Revaluation Books, Exeter, United Kingdom
Book
Paperback. Condition: Brand New. reprint edition. 672 pages. 9.25x6.10x1.93 inches. In Stock.
Published by Springer, 2000
ISBN 10: 3540667725ISBN 13: 9783540667728
Seller: GoldBooks, Denver, CO, U.S.A.
Book
Hardcover. Condition: new. New Copy. Customer Service Guaranteed.
Published by Springer, 2012
ISBN 10: 3642630960ISBN 13: 9783642630965
Seller: Majestic Books, Hounslow, United Kingdom
Book Print on Demand
Condition: New. Print on Demand pp. 672.
Published by Materials Research Society, 1996
ISBN 10: 155899324XISBN 13: 9781558993242
Seller: dsmbooks, Liverpool, United Kingdom
Book
hardcover. Condition: Good. Good. book.
Published by Gallery One, 2003
ISBN 10: 0972268200ISBN 13: 9780972268202
Seller: GoldenWavesOfBooks, Fayetteville, TX, U.S.A.
Book
Hardcover. Condition: new. New. Fast Shipping and good customer service.
Published by Gallery One, 2003
ISBN 10: 0972268200ISBN 13: 9780972268202
Seller: dsmbooks, Liverpool, United Kingdom
Book
hardcover. Condition: New. New. book.